JPH0338911U - - Google Patents

Info

Publication number
JPH0338911U
JPH0338911U JP9966289U JP9966289U JPH0338911U JP H0338911 U JPH0338911 U JP H0338911U JP 9966289 U JP9966289 U JP 9966289U JP 9966289 U JP9966289 U JP 9966289U JP H0338911 U JPH0338911 U JP H0338911U
Authority
JP
Japan
Prior art keywords
resin
piezoelectric vibrator
lead
molded
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9966289U
Other languages
English (en)
Japanese (ja)
Other versions
JP2543874Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989099662U priority Critical patent/JP2543874Y2/ja
Publication of JPH0338911U publication Critical patent/JPH0338911U/ja
Application granted granted Critical
Publication of JP2543874Y2 publication Critical patent/JP2543874Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Oscillators With Electromechanical Resonators (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1989099662U 1989-08-25 1989-08-25 樹脂モールド型圧電発振器及び樹脂モールド型圧電振動子 Expired - Lifetime JP2543874Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989099662U JP2543874Y2 (ja) 1989-08-25 1989-08-25 樹脂モールド型圧電発振器及び樹脂モールド型圧電振動子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989099662U JP2543874Y2 (ja) 1989-08-25 1989-08-25 樹脂モールド型圧電発振器及び樹脂モールド型圧電振動子

Publications (2)

Publication Number Publication Date
JPH0338911U true JPH0338911U (en]) 1991-04-15
JP2543874Y2 JP2543874Y2 (ja) 1997-08-13

Family

ID=31648704

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989099662U Expired - Lifetime JP2543874Y2 (ja) 1989-08-25 1989-08-25 樹脂モールド型圧電発振器及び樹脂モールド型圧電振動子

Country Status (1)

Country Link
JP (1) JP2543874Y2 (en])

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63102313U (en]) * 1986-12-19 1988-07-04

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63102313U (en]) * 1986-12-19 1988-07-04

Also Published As

Publication number Publication date
JP2543874Y2 (ja) 1997-08-13

Similar Documents

Publication Publication Date Title
US5006919A (en) Integrated circuit package
JP3259377B2 (ja) 半導体装置
JPH0338911U (en])
JPH0338910U (en])
JPH0576804B2 (en])
JPS63102313U (en])
JPS6116702Y2 (en])
JPH0516724Y2 (en])
JPH0397225U (en])
JP3587001B2 (ja) 圧力センサ
JPS6236299Y2 (en])
JPH0345653U (en])
JPS638146Y2 (en])
JPH02172240A (ja) 電子部品の製造方法
JPH0170360U (en])
JPH02137219U (en])
JPS58138352U (ja) 半導体パツケ−ジ用のリ−ド端子
JPS61149347U (en])
JPH0242445U (en])
JPS62140744U (en])
JPS62114457U (en])
JPH0436251U (en])
JPH04340731A (ja) 半導体装置の製造方法
JPS63177432A (ja) 半導体パッケージおよびその製造方法
JPH0176040U (en])

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term